Tuesday, October 21, 2008

First working "Moorestown" platform showcased


At the ongoing IDF (Intel Developer Forum) at Taiwan, senior vice president and general manager of Intel's Ultra Mobility Group, Anand Chandrasheker in his keynote discussed how technology, innovation and strong industry collaboration have driven the digital economy for the past 40 years. Looking forward to the next 40, Chandrasheker sees the emergence of purpose-built devices, MIDs and hand helds that are set to deliver a targeted computing experience.

The Atom line-up of processors are being though of the first ones to be targeted at these "targeted" segments. The Atom is slowly gaining inroads in to the Netbook category with some chips already crunching numbers on devices ranging from a Home telephones to digital photo frames. The Moorestown platform is the obvious successor to the Atom line up with some basic differences. To start with, Moorestown has an SOC (System on Chip) called "Lincroft" which integrates the processor, graphics, memory controller on to a single chip and an I/O hub called the "Langwell".

This is different to the Atoms approach which splits the graphics off to the hub. The change in design is expected to result in better graphics performance with an overall reduction in size. The Langwell will also give way to an unified wireless module known as Evans Peak which is said to integrate all the wireless modules -- including WiMAX support. With the MID pie in sight, Intel has already confirmed 3G support -- thanks to its collaboration with Ericsson for HSPA modules. This, however is not the first time that Intel has fiddled with 3G. Its previous attempt at 3G chips with the Centrino back in 2007 was shelved owing to lukewarm public response. This time however, the target being MIDs and handhelds, the response is expected to be overwhelming.
Moorestown is all set to make its debut in 2009-2010 with elder sibling "Nehalem".


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