It was earlier thought that Nvidia would switch to eutectic solder bumps instead of the problem causing high-lead ones, to reduce the failure rate in its GPUs. However, according to a TG Daily report, “industry sources” have tipped that Nvidia will continue to use the older solder bumps even for GPUs due in early 2009.
This comes at a time when Nvidia there were reports about the shift to eutectic underfill in the G84, G86 and G92 GPUs. It is still not clear which future Nvidia GPUs will continue to get the high-lead solder bump treatment. As of now, what we do know is that Nvidia has the GT212 (thought to be a chipset) and GT206, a 55 nm GTX260 replacement under wraps.
While Nvidia too seems to be tight-lipped and have restrained from commenting on why it chose to stick to lead solder bumps, it is thought that the company might have found a fix to the issues plaguing it – and thus, lending a new lease of life to the old underfill.
With two lawsuits looming large – thanks to complications caused by the GPU failures, Nvidia might face increasing pressure to switch to eutectic underfills very soon. However, doubt still remains on how smooth a transition this could turn out to be.
Source: TGDaily
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